TFS-CP1-125 Pad Printing Machine: Efficient Solution for Silver Paste Printing on Piezoelectric Ceramic Chips

[Abstract] As demand for piezoelectric ceramic chips rises, silver paste printing is critical for stability. The TFS-CP1-125 pad printing machine, tailored for such chips, overcomes challenges in printing on curved & sharp surfaces. High-precision servo control & an 18-degree flexible pad ensure uniform printing on all sides, preventing ink issues. Multi-stage printing & UV curing enhance the paste's uniformity , boosting conductivity . With speeds up to 25 pieces/min and 10,000+ daily output, it meets large-scale production needs.

I. Market and Application Background of Piezoelectric Ceramic Chips

1. Market Overview of Piezoelectric Ceramic Chips

Piezoelectric ceramic chips are crucial materials in modern high-tech industries, utilizing the piezoelectric effect to efficiently convert mechanical energy into electrical energy. In 2023, the global market size for piezoelectric ceramics reached $5.2 billion, and it is expected to exceed $8 billion by 2030, with a compound annual growth rate (CAGR) of 6.3%. These materials are widely used in high-end industries such as medical, electronics, aerospace, and defense, with demand continuing to rise.

2. Main Application Areas of Piezoelectric Ceramic Chips

Piezoelectric ceramic chips play a key role in various industries. Representative applications include:

 •   Medical Devices: Such as dental cleaning instruments, beauty devices, and ultrasonic knives, enabling precise operations through high-frequency vibrations.

 •   Electronics: Piezoelectric sensors, dispensing devices, and ultrasonic detectors that enable accurate signal transmission and processing.

 •   Aerospace and Defense: Laser weapon fast-response mirrors, satellite active vibration control platforms, enhancing device stability and response speed.

 •   Industrial Manufacturing: Ultrasonic welding, precision positioning systems, providing efficient processing and connection solutions.

The performance of piezoelectric ceramic chips is directly related to their printed layers, particularly the quality of silver paste printing, which significantly impacts their conductivity and service life.

II. Overview of TFS-CP1-125 Equipment

The TFS-CP1-125 is an advanced pad printing machine specifically designed by TEFISEN for high-precision curved silver paste printing, optimized for small-size, high-demand sheet materials.

1. TFS-CP1-125 Technical Features

 •   High-precision Servo Control: The equipment is equipped with a multi-axis servo system, enabling synchronized printing on the top, bottom, and side surfaces, with a positioning error of less than ±0.02mm.

 •   Flexible Pad: It uses an 18-degree pad, suitable for uniform printing on complex curves and sharp edges.

 •   Real-time Pressure Adjustment: Through PLC control, the pressure is adjusted to achieve precise control of silver paste thickness on different surfaces.

 •   Multi-function Fixture: Combining vacuum adsorption and rotational functions to ensure stable printing at different angles.

2. TFS-CP1-125 Technical Parameters

 •   Ink Cup Size: Diameter 60mm.

 •   Applicable Material Size: Diameter 50mm.

 •   Printing Speed: Up to 1500 pieces/hour (multi-surface simultaneous printing).

 •   Precision Range: ±0.02mm.

III. Challenges in Silver Paste Printing Technology

Printing silver paste on piezoelectric ceramic chips with a diameter of 48mm and thickness of 0.82mm requires even coverage of a 3-5µm conductive layer on the top, bottom, and sides. The main technical challenges are:

1. Side Surface Curved Printing

 •   The side surface is a concave curve with sharp edges at both ends, making it prone to silver paste accumulation or underprinting at the edges, which affects electrical performance.

 •   The varying curvature increases uneven contact between the pad and the material, leading to uneven printing thickness.

2. Uniform Silver Paste Thickness Control

The silver paste needs to form a uniform conductive layer, with thickness variation controlled within ±0.5µm. Too thin will cause circuit discontinuity, and too thick will increase resistance.

3. Multi-surface Printing Coordination

The top, bottom, and side surfaces of the material must be printed simultaneously to avoid misalignment and ghosting from multiple operations.

4. Complexity of Process Parameter Adjustment

Comprehensive adjustments of pad pressure, printing speed, angle, and silver paste viscosity are needed to achieve optimal printing results.

IV. Technical Solutions

The TFS-CP1-125 machine employs the following technological and process optimizations to address the above challenges:

1. Customized 18-degree Pad Application

After extensive testing, an 18-degree flexible pad was selected:

 •   Flexibility: It adapts to the curvature and sharp edges of the material, preventing underprinting and accumulation.

 •   Precise Pressure Control: The pad contact pressure is set at 0.5N for the top and bottom surfaces and 0.7N for the side curved printing.

2. Multi-stage Printing Process

 •   First Stage: A thin base layer of silver paste (1.5µm) ensures even coverage and fills small defects.

 •   Second Stage: The main printing layer reaches 3-5µm, ensuring conductivity.

 •   UV Curing: After each print, the layer is cured to prevent pattern movement or overlapping errors.

3. Vacuum Adsorption and Rotational Fixture

The fixture combines vacuum adsorption with automatic rotation:

 •   Vacuum Adsorption: Holds the material in place to prevent small displacements.

 •   Automatic Rotation: Precisely adjusts the material position, ensuring uniform contact between the side and the pad.

V. Application Examples and Production Data Analysis

A customer's piezoelectric ceramic chips (48mm in diameter, 0.82mm thick) were printed with silver paste using the TFS-CP1-125 machine. The production data is as follows:

From the production data analysis, the following advantages of the machine are evident:

1. Improved Side Surface Uniformity: The combination of the 18-degree pad and vacuum adsorption fixture effectively prevents common issues such as edge underprinting and silver paste accumulation on the side surface.

2. Enhanced Printing Layer Stability: The multi-stage printing process with UV curing ensures even layer thickness and improves adhesion, preventing uneven curing caused by excessive thickness in a single layer.

3. Significant Increase in Production Efficiency: With a printing speed of 25 pieces per minute, the machine can easily exceed 10,000 pieces per day, meeting the demands of large-scale production.

VI. Quality Control and Customer Feedback

1. Quality Control Methods

 •   Online Inspection: Real-time monitoring of silver paste layer thickness and uniformity, ensuring a deviation of within ±0.5µm.

 •   Sampling Tests: 20 samples per batch are tested for electrical performance and layer adhesion.

 •   Equipment Maintenance: Regular cleaning of pads and screens to avoid contamination affecting quality.

2. Customer Recognition of TFS-CP1-125

 •   Stable Quality: Issues such as edge underprinting and uneven thickness have been thoroughly resolved, with a product qualification rate close to 100%.

 •   Increased Production Efficiency: Compared to traditional methods, production efficiency has increased by 50%, while also reducing silver paste waste.

 •   Ease of Operation: The machine is easy to operate, reducing manual intervention and improving stability.

VII. Future Development and Technological Outlook

As the demand for piezoelectric ceramic chips increases, the precision and efficiency of the silver paste printing process will be key to maintaining competitive advantage. In the future, pad printing equipment will develop in the following directions:

 •   Higher Automation: Achieving fully automated production and parameter adjustments for multiple batches through intelligent control systems.

 •   Multi-process Compatibility: Integrating pad printing, spraying, laser etching, and other processes to meet complex product requirements.

 •   Environmental Performance Enhancement: Developing low-VOC silver paste and optimizing the printing process to comply with environmental regulations.

Thus, the successful application of the TFS-CP1-125 pad printing machine in silver paste printing for piezoelectric ceramic chips not only resolves the challenges of complex curved surface printing but also provides customers with efficient and stable production solutions, setting a high standard in high-end electronic component manufacturing.